Controlled-Impedance Vias

Vias are often the weakest link in high-frequency designs. At Verdant Sync, we address this challenge head-on by performing detailed 3D Finite Element Method (FEM) analysis on every critical via structure during the design phase.

Using powerful simulation software, the 3D simulation accurately models the complex electromagnetic field around your vias to precisely calculate their impedance and identify potential discontinuities. This allows us to optimize the via geometry, pad sizes, and anti-pad clearances to achieve the exact controlled impedance you require.

By finalizing your return path vias and validating their performance before layout completion, we eliminate the need for expensive post-fabrication fixes. Our goal is to deliver a robust, predictable, and high-performance interconnect solution for your most demanding applications.